NPTEL : Micro and Smart Systems (Mechanical Engineering)

Co-ordinators : Dr. K.J. Vinoy, Prof. S. Gopalakrishnan, Prof. K.N. Bhat, Prof. G.K. Anathasuresh


Lecture 1 - Glimpses of Microsystems: Scaling Effects

Lecture 2 - Smart Materials and Systems

Lecture 3 - Microsensors

Lecture 4 - Microactuators

Lecture 5 - Microsystems: some Examples

Lecture 6 - Smart systems Application and Structural Health Monitoring

Lecture 7 - Microfabrication Technologies

Lecture 8 - Thin-film Materials and their Deposition

Lecture 9 - Approaches for Pattern Transfer

Lecture 10 - Surface Micromachining of Microstructures

Lecture 11 - Bulk Micromachining of Microsystems

Lecture 12 - Extended Approaches for Working Microsystems

Lecture 13 - Non-conventional Approaches for Microsystems

Lecture 14 - Packaging of Microsystems

Lecture 15 - Deformation Strains and Stresses

Lecture 16 - Microdevice Suspensions: Lumped Modeling

Lecture 17 - Residual Stress and Stress Gradients

Lecture 18 - Torsion and Twist

Lecture 19 - Vibrations of Microsystems Devices: Part-1

Lecture 20 - Vibrations of Microsystems Devices: Part-2 Micromachined Gyroscopes: Part-1

Lecture 21 - Micromachined Gyroscopes: Part-2 Modelling of Coupled Electrostatic Microsystems: Part-1

Lecture 22 - Modelling of Coupled Electrostatic Microsystems: Part-2

Lecture 23 - Coupled Electrothermal-elastic Modelling

Lecture 24 - Modelling of Microsystems: Scaling Effects

Lecture 25 - Finite Element Method and Microsystems

Lecture 26 - Theoretical Basis for the Finite Element Method

Lecture 27 - Energy Theorems and Weak Form of the Governing Equation

Lecture 28 - Finite Element Equation Development and Shape Functions

Lecture 29 - Isoparametric FE Formulation and some Examples

Lecture 30 - Finite Element for Structures with Piezoelectric Materials

Lecture 31 - Semiconductor Device Physics

Lecture 32 - BJT and MOSFET Characteristics and Op-Amps

Lecture 33 - Op-Amp Circuits and Signal conditioning for Microsystems Devices

Lecture 34 - Control and Microsystems

Lecture 35 - Vibration Control of a Beam

Lecture 36 - Signal Conditioning Circuits and Integration of Microsystems and Microelectronics

Lecture 37 - Pressure Sensor Design Concepts, Processing, and Packaging: Part-1

Lecture 38 - Pressure Sensor Design Concepts, Processing, and Packaging: Part-2

Lecture 39 - Pressure Sensor Design Concepts, Processing, and Packaging: Part-3 Capacitive Micro-accelerometer: Part-1

Lecture 40 - Capacitive Micro-accelerometer: Part-2